3536™ provides the following product characteristics:
Components One component
Product Benefits • Reworkable
• Cures rapidly at low temperatures
• Minimizes thermal stress
• Rapid device throughput
• Excellent protection for solder
joints agains mechanical stress
Cure Heat Cure
Chip scale packages and BGA
3536™ epoxy reworkable underfill is designed to provide
protection for solder joints against mechanical stress such as
shock, drop and vibration.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Viscosity, Brookfield , 25 °C, mPa·s (cP):
Pot Life @ 25ºC, days >14
Shelf Life @ 2 to 8°C, months 6
Flash Point - See MSDS
TYPICAL CURING PERFORMANCE
Recommended Cure Schedule
5 minutes @ 120°C
2 minutes @ 130°C
Curing above 140°C is not recommended.
The above cure profile is a guideline recommendation. Cure
conditions (time and temperature) may vary based on
customers' experience and their application requirements, as
well as customer curing equipment, oven loading and actual
TYPICAL PROPERTIES OF CURED MATERIAL
Cured for 60 minutes @ 120ºC,
Coefficient of Thermal Expansion , ppm/°C:
Below Tg 63
Above Tg 178
Glass Transition Temperature (Tg) by TMA, °C 53
Storage Modulus, GPa 3.5
For safe handling information on this product, consult the
Material Safety Data Sheet, (MSDS).
This product is not recommended for use in pure oxygen
and/or oxygen rich systems and should not be selected as
a sealant for chlorine or other strong oxidizing materials.
Not for product specifications
The technical data contained herein are intended as reference
only. Please contact your local quality department for
assistance and recommendations on specifications for this
DIRECTIONS FOR USE
1. For best results, substrate should be preheated (up to 70
°C) to allow fast capillary flow.
1. Heat the underfill approximately 240ºC using a hot air
nozzle on standard BGA rework equipment.
2. Component can be twisted and removed.
3. Clean and remove residue using a tacky flux or liquid flux
and a solder removal vacuum tool.
Store product in the unopened container in a dry location.
Storage information may be indicated on the product container
Optimal Storage: 2 to 8°C. Storage below 2°C or greater
than 8°C can adversely affect product properties.
Material removed from containers may be contaminated during
use. Do not return product to the original container. Henkel
Corporation cannot assume responsibility for product which
has been contaminated or stored under conditions other than
those previously indicated. If additional information is required,
please contact your local Technical Service Center or
Customer Service Representative.
(°C x 1.8) + 32 = °F
kV/mm x 25.4 = V/mil
mm / 25.4 = inches
N x 0.225 = lb
N/mm x 5.71 = lb/in
N/mm² x 145 = psi
MPa x 145 = psi
N·m x 8.851 = lb·in
N·m x 0.738 = lb·ft
N·mm x 0.142 = oz·in
mPa·s = cP