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    • 型 号:loctite3536
    • 规 格:30ML/支
    • 品 牌:LOCTITE
    • 单 价:100.00元/支
    • 供货总量:1000 支
    • 最小起订量:1 支
    • 有效期至:长期有效
    • 发货期限:付款之日起3天内发货
    • 最后更新:2018-06-14
    • 浏览次数:36

    产品详情

     PRODUCT DESCRIPTION
    3536™ provides the following product characteristics:
    Technology Epoxy
    Appearance Black
    Components One component
    Product Benefits • Reworkable
    • Cures rapidly at low temperatures
    • Minimizes thermal stress
    • Rapid device throughput
    • Excellent protection for solder
    joints agains mechanical stress
    Cure Heat Cure
    Application Underfill
    Typical Assembly
    Applications
    Chip scale packages and BGA
    3536™ epoxy reworkable underfill is designed to provide
    protection for solder joints against mechanical stress such as
    shock, drop and vibration.
    TYPICAL PROPERTIES OF UNCURED MATERIAL
    Viscosity, Brookfield , 25 °C, mPa·s (cP):
    CP52/20 1,800
    Pot Life @ 25ºC, days >14
    Shelf Life @ 2 to 8°C, months 6
    Flash Point - See MSDS
    TYPICAL CURING PERFORMANCE
    Recommended Cure Schedule
    5 minutes @ 120°C
    2 minutes @ 130°C
    Curing above 140°C is not recommended.
    The above cure profile is a guideline recommendation. Cure
    conditions (time and temperature) may vary based on
    customers' experience and their application requirements, as
    well as customer curing equipment, oven loading and actual
    oven temperatures.
    TYPICAL PROPERTIES OF CURED MATERIAL
    Cured for 60 minutes @ 120ºC,
    Physical Properties
    Coefficient of Thermal Expansion , ppm/°C:
    Below Tg 63
    Above Tg 178
    Glass Transition Temperature (Tg) by TMA, °C 53
    Storage Modulus, GPa 3.5
    GENERAL INFORMATION
    For safe handling information on this product, consult the
    Material Safety Data Sheet, (MSDS).
    This product is not recommended for use in pure oxygen
    and/or oxygen rich systems and should not be selected as
    a sealant for chlorine or other strong oxidizing materials.
    Not for product specifications
    The technical data contained herein are intended as reference
    only. Please contact your local quality department for
    assistance and recommendations on specifications for this
    product.
    DIRECTIONS FOR USE
    1. For best results, substrate should be preheated (up to 70
    °C) to allow fast capillary flow.
    Removal Procedure
    1. Heat the underfill approximately 240ºC using a hot air
    nozzle on standard BGA rework equipment.
    2. Component can be twisted and removed.
    3. Clean and remove residue using a tacky flux or liquid flux
    and a solder removal vacuum tool.
    Storage
    Store product in the unopened container in a dry location.
    Storage information may be indicated on the product container
    labeling.
    Optimal Storage: 2 to 8°C. Storage below 2°C or greater
    than 8°C can adversely affect product properties.
    Material removed from containers may be contaminated during
    use. Do not return product to the original container. Henkel
    Corporation cannot assume responsibility for product which
    has been contaminated or stored under conditions other than
    those previously indicated. If additional information is required,
    please contact your local Technical Service Center or
    Customer Service Representative.
    Conversions
    (°C x 1.8) + 32 = °F
    kV/mm x 25.4 = V/mil
    mm / 25.4 = inches
    N x 0.225 = lb
    N/mm x 5.71 = lb/in
    N/mm² x 145 = psi
    MPa x 145 = psi
    N·m x 8.851 = lb·in
    N·m x 0.738 = lb·ft
    N·mm x 0.142 = oz·in
    mPa·s = cP

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    公司基本资料信息

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    • 深圳汉泰实业有限公司
    • 联系人:杨振   
    • 电   话:
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    • 地   区:广东 深圳市
    • 地   址:广东深圳福田爱地大厦
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